electroless plating

[Naste]

i have read alot of artikel n book about throughole plating..and the best methode is catalizing the hole with stannous and palladium colloid...stannous chloride and palladium chloride with critical percentage..
Then Electroless with the mix of sodium sulphate, NaOH and formaldehide..i haven't try that..but its time to try this stuff...i'll post the result

[Ichan]

Naste, what is the role of sodium sulphate on the electroless copper plating? Never heard about that.

For Palladium catalyst, as a colloidal system - the most important thing is to maintain its colloidal state. If somehow the stability of the colloid disturbed in which the colloid can be shifted to become a solution or a suspension then it will will ruin all the expensive Palladium.

-ichan

[Naste]

oh im sorry i dont think so with sodium sulphate...i mean the mix of copper sulpahte, sodium cyanide, and formaldehide...thanks for your comment.
yes, the palladium colloid is very critical..it must be controlled everytime--i read from article that the colloid must be controlled everyday..